Ngokupheleleyo Umgca Wokuprinta weMaski eSolder eThin

Inkcazelo emfutshane:

Ukwazisa ngemveliso: Uqwalaselo lwesixhobo somgca wemveliso: uxinzelelo olukrelekrele lokuplaga-ngomatshini → umatshini wokulinganisa ozenzekelayo → Umshicileli wesikrini semaski somthengisi okrelekrele → i-oveni yokuhambisa exhonyiweyo →B umshicileli okrelekrele wesixhobo sokuhambisa imaski → i-oveni yokuhambisa exhonyiweyo
Umgca wokuvelisa imaski yepleyiti ecwengileyo ezenzekelayo: iyasebenza kwinkqubo yoshicilelo lwe-inki ye-inki yokuprinta yamanani amaninzi, iibhodi zesekethe ezibhityileyo / ezishinyeneyo.Ithatha i-hardware yombane eyaziwayo ukucwangciswa kwe-hardware ekhaya nakwamanye amazwe, ithwala iikhonsepthi zokuyila eziphambili, i-stable mechanical structure , kwaye ixhaswa ngenani lobuchwepheshe obunelungelo lobunikazi.Ukuqinisekisa imveliso ezinzileyo nethembekileyo kunye nokusebenza kweemveliso.


Iinkcukacha zeMveliso

Iithegi zeMveliso

Ukusebenza kweMveliso

Inkqubo yokulungelelaniswa kweCCD yamkelwa, kwaye inombolo yezinto eziphathekayo itshintshelwe kwi-3-5min
Iyahambelana nokuveliswa kweeplati ze-0.4mm-3.0mm
Umthamo wemveliso ufikelela kwi-3-6pnl / min
Qonda [idijithali], [iparameterisation] kunye [nobukrelekrele]
I-Manipulator ilayisha kwaye ikhuphela ukuqonda umgca wonke ngokuzenzekelayo

Uqwalaselo lweHardware

I-PLC:Mitsubishi
Isikhokhelo sikaloliwe:THK
Isilinda:I-AIRTAC
Unxibelelwano:Mitsubishi

Isikrini esibanjwayo:weinview
Ibhanti ye-synchronous:Megadyne
Ukuthwala:NSK
Isikrufu sebhola:I-TBI

IParameter yobuGcisa

Ubungakanani boBulungisa
Ubuninzi: 620mm * 720mm
Ubuncinci: 400mm * 400mm

UkuXhobisa ukutyeba
Ubukhulu obukhulu: 3.0mm
Thinnest: 0.4mm

Ubuchule boMveliso
Ubuninzi: 6pnl / min
Ubuncinci: 3pnl / min

Malunga neDongyuan

Ubhaliso olubonakalayo: 2 iikhamera zeCCD zokubona uphawu lobhaliso okanye umngxuma kwi-substrate ngokukhawuleza, ukubala ngokwezibalo indawo ngaphandle-seti imali ebonelela kwinkqubo yolawulo, inkqubo yosasazo ye-X/Y servo iqhuba itheyibhile yobhaliso kwangoko ukuya kwindawo echanekileyo.

Indawo yeLaser:Imodyuli yekhamera yeCCD itshixiwe / ivulwe ngokutshintsha kolawulo lwe-pneumatic, ukufuduka ngokukhawuleza kunye nokulungiswa kwesandla ngasemva / ngasekunene ngasekhohlo, idityaniswe ngentelekelelo yenqaku lelaser ukuze ihambe ngokukhawuleza kwindawo ekujoliswe kuyo.

Uhlengahlengiso oluNcinci lweSkrini soLawulo lweDijithali:buyisela imanuwali amanqaku amathathu uhlengahlengiso oluncinci, olungakwaziyo ukuhlengahlengisa ngokuchanekileyo ukufumana indawo eceliweyo, imbuyekezo yolawulo lwedijithali ifumana impumelelo echanekileyo ekhawulezileyo.

Buffer Stacker:xa umshicileli wesikrini esisecaleni u-B eyeka ukucocwa kwesikrini, Icala elingenayo emva kokuprintwa, isitakhi sethutyana kwisithinteli esipakishweyo ukunqanda ifuthe lokwenziwa kwemveliso.

UkuJika kwisikhundla esizenzekelayo: ifezekisiwe A side legend yoshicilelo kwaye ithuthwe ukujika, servo drive CCD ukubona uphawu lobhaliso kwicala B kushicilelo legend.

I-Clipper Flattening:I-substrate ikhubazeke emva kokucutshungulwa okuhlukeneyo, i-clipper iyatsala ukwandisa amacala amabini athambileyo ngelixa ijika ukuze iququzelele ukubhaliswa kweCCD, ngakumbi ukusebenza kwefilimu ebhityileyo ebalaseleyo.


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