Eli nqaku libonelela ngentshayelelo ebanzi kwiimfuno zenkqubo yokubhaka yebhodi yesekethe yePCB kunye neengcebiso zokonga amandla.Ngengxaki yamandla eyandayo yehlabathi kunye nokomelezwa kwemithetho yokusingqongileyo, abavelisi bePCB babeke phambili iimfuno eziphezulu zomgangatho wokonga umbane wezixhobo.Ukubhaka yinkqubo ebalulekileyo kwinkqubo yokuvelisa iPCB.Ukusetyenziswa rhoqo kudla umthamo omkhulu wombane.Ngoko ke, ukuphuculwa kwezixhobo zokubhaka ukuphucula ugcino lwamandla ibe yenye yeendlela zebhodi yebhodi yePCB ukonga amandla kunye nokunciphisa iindleko.
Inkqubo yokubhaka iphantse iqhube kuyo yonke inkqubo yemveliso yebhodi yesekethe yePCB.Oku kulandelayo kuya kukwazisa kwiimfuno zenkqubo yokubhaka kwimveliso yebhodi yesekethe yePCB.
1. Amanyathelo enkqubo afunekayo ukubhaka iibhodi zePBC
1. I-Lamination, i-exposure, kunye ne-browning ekuveliseni iipaneli zangaphakathi zangaphakathi zifuna ukungena kwigumbi lokumisa ukubhaka.
2. Ukujoliswa, ukudibanisa kunye nokugaya emva kokulahlwa kuyadingeka ukususa umswakama, i-solvent kunye noxinzelelo lwangaphakathi, ukuzinzisa isakhiwo kunye nokuphucula ukunamathela, kwaye kufuna unyango lokubhaka.
3. Ubhedu oluphambili emva kokugaya kufuneka lubhakwe ukukhuthaza ukuzinza kwenkqubo ye-electroplating.
4. Unyango lwangaphambili, i-lamination, i-exposure kunye nophuhliso kwimveliso yangaphandle ye-layer yonke ifuna ubushushu bokubhaka ukuqhuba ukusabela kweekhemikhali ukuphucula ukusebenza kwezinto kunye nemiphumo yokucubungula.
5. Ukuprintwa, ukubhaka kwangaphambili, ukuvezwa, kunye nophuhliso phambi kokuba imaski ye-solder ifune ukubhaka ukuqinisekisa ukuzinza kunye nokubambelela kwizinto eziphathekayo zemaski.
6. I-Pickling kunye nokushicilela phambi kokuprintwa kwesicatshulwa kufuna ukubhaka ukukhuthaza ukusabela kweekhemikhali kunye nokuzinza kwezinto.
7. Ukubhaka emva kokunyangwa kwendawo ye-OSP kubalulekile kuzinzo kunye nokubambelela kwizinto ze-OSP.
8. Kufuneka ibhakwe ngaphambi kokubunjwa ukuze kuqinisekiswe ukoma kwezinto eziphathekayo, ukuphucula ukunamathela kunye nezinye izinto, kwaye uqinisekise umphumo wokubumba.
9. Ngaphambi kovavanyo lwe-flying probe, ukwenzela ukuba ugweme ubuxoki kunye nezigwebo eziphosakeleyo ezibangelwa yimpembelelo yomswakama, ukubhaka kwakhona kuyafuneka.
10. Ukubhaka unyango phambi kokuhlolwa kwe-FQC kukuthintela ukufuma phezu komhlaba okanye ngaphakathi kwebhodi ye-PCB ekwenzeni iziphumo zovavanyo zingachanekanga.
2. Inkqubo yokubhaka ngokuqhelekileyo yahlulahlulwe ibe ngamanqanaba amabini: ukubhaka okuphezulu kobushushu kunye nokubhaka okuphantsi kobushushu:
1. Ubushushu obuphezulu bokubhaka bulawulwa ngokubanzi malunga ne-110°C, kunye nobude malunga neeyure ze-1.5-4;
2. Ubushushu obuphantsi bokubhaka bulawulwa ngokubanzi malunga ne-70°C, kwaye ubude bude kangangeeyure ezingama-3-16.
3. Ngexesha lenkqubo yokubhaka ibhodi yesekethe yePCB, ezi zixhobo zilandelayo zokubhaka nezokomisa kufuneka zisetyenziswe:
I-oven ethe nkqo, eyonga amandla etonela, umjikelo ozenzekelayo wokuphakamisa umgca wemveliso yokubhaka, i-oveni ye-infrared yetonela kunye nezinye izixhobo eziprintiweyo zebhodi yesekethe yePCB.
Iintlobo ezahlukeneyo zezixhobo ze-oveni ye-PCB zisetyenziselwa iimfuno ezahlukeneyo zokubhaka, ezinje: Iplagi yebhodi ye-PCB yomngxuma, i-solder mask screen yoshicilelo lokubhaka, efuna imisebenzi ezenzekelayo yomthamo omkhulu.Ii-oveni zetonela eyonga amandla zihlala zisetyenziselwa ukugcina uninzi lwabasebenzi kunye nezixhobo zemathiriyeli ngelixa zifezekisa ukusebenza kakuhle okuphezulu.Ukusebenza kakuhle kokubhaka, ukusebenza kakuhle kwe-thermal kunye nesantya sokusetyenziswa kwamandla, uqoqosho kunye nokusingqongileyo, kusetyenziswa ngokubanzi kushishino lwebhodi yesekethe kwi-solder mask pre-baking kunye nesicatshulwa emva kokubhaka iibhodi zePCB;okwesibini, isetyenziselwa ngakumbi ukubhaka kunye nokomisa ukufuma kwebhodi ye-PCB kunye noxinzelelo lwangaphakathi.Yi-oveni yokujikeleza komoya othe nkqo enexabiso eliphantsi lezixhobo, inyawo encinci kwaye ilungele ukubhaka okuguquguqukayo okuninzi.
4. Izisombululo zokubhaka zebhodi yesekethe ye-PCB, iingcebiso zezixhobo ze-oveni:
Ukushwankathela, yinto engenakuthintelwa ukuba abavelisi bebhodi yesekethe yePCB baneemfuno eziphezulu neziphezulu kumanqanaba okonga amandla ezixhobo.Isikhokelo esibaluleke kakhulu sokuphucula amanqanaba okugcina amandla, ukugcina iindleko kunye nokuphucula ukusebenza kakuhle kwemveliso ngokuphucula okanye ukutshintsha izixhobo zenkqubo yokubhaka.Ii-oveni zetonela eyonga amandla zineengenelo zokonga umbane, ukukhuselwa kwendalo, kunye nokusebenza kakuhle kakhulu, kwaye ngoku zisetyenziswa ngokubanzi.Okwesibini, ii-oveni zokujikeleza komoya oshushu zineengenelo ezizodwa kwiibhodi zePCB eziphezulu ezifuna ukuchaneka okuphezulu kunye nokucoceka kokubhaka okunje ngeebhodi zokuthwala i-IC.Ukongeza, banemitha ye-infrared.Izitofu zetonela kunye nezinye izixhobo ze-oveni ngoku sele zikhulile ngokomisa kunye nezisombululo zokunyanga.
Njengenkokeli kugcino lwamandla, iXinjinhui ngokuqhubekayo ivelisa izinto ezintsha kwaye iqhuba inguqu esebenzayo.Ngo-2013, inkampani yasungula isizukulwana sokuqala se-PCB yombhalo we-post-baking i-tunnel-type ye-oven ye-oven ye-oven yokushicilela i-oven, ephucule ukusebenza kokugcina amandla ngama-20% xa kuthelekiswa nezixhobo zemveli.Ngo-2018, inkampani yaphinda yaphehlelela i-oven ye-PCB yesizukulwana sesibini se-post-baking ye-oveni, ephumelele ukuphuculwa kwe-leapfrog ye-35% ekongeni amandla xa kuthelekiswa nesizukulwana sokuqala.Ngo-2023, ngophando oluyimpumelelo kunye nophuhliso lwenani lelungelo elilodwa lomenzi wechiza kunye nobuchwepheshe obutsha, inqanaba lokonga amandla enkampani linyuke laya kuthi ga kwi-55% xa lithelekiswa nesizukulwana sokuqala, kwaye liye lathandwa ziinkampani ezininzi eziphezulu ze-100 kwi-PCB. ishishini, kuquka Jingwang Electronics.Ezi nkampani zimenywe nguXin Jinhui ukuba zityelele kwaye zinxibelelane neephaneli zovavanyo lwefektri.Kwixesha elizayo, i-Xinjinhui iya kuphinda iqalise izixhobo eziphezulu zobuchwepheshe.Nceda uhlale ubukele, kwaye wamkelekile ukuba usitsalele umnxeba ukuze udibane kwaye wenze idinga lokusityelela kunxibelelwano lobuso ngobuso.
Ixesha lokuposa: Mar-11-2024