I-oveni yetonela eyonga amandla inceda abavelisi bePCB ukuba baphindaphinde izibonelelo ze-solder imaski yokubhaka kwangaphambili kunye neenkqubo zokubhaka emva kokubhaka.

Kwintsimi yokuvelisa i-elektroniki, inkqubo yokuvelisa iibhodi zeesekethe eziprintiweyo (PCBs) inzima kakhulu kwaye idinga amakhonkco amaninzi ukugqiba.Phakathi kwabo, ibhodi yesekethe ye-PCB yebhodi ye-solder imaski yokushicilela isikrini sangaphambi kokubhaka kunye nokushicilela isikrini sesicatshulwa emva kokubhaka, kunye nokumisa umgca wemveliso zikhonkco eziphambili, ezinokuphucula ukusebenza kakuhle kwemveliso kunye nomgangatho we-PCB.Eli nqaku liza kukunika intshayelelo enzulu kwiingenelo kunye neemeko zesicelo somgca wemveliso, kukunceda uqonde ngcono inkqubo yokumisa ushicilelo lwe-PCB, kwaye ikubonise ukusebenza kwezixhobo ezigqwesileyo.

PCB yesekethe ibhodi solder imaski pre-yokubhaka, umbhalo post-yokubhaka, kunye netonela imigca imveliso yokomisa eziko zamkele iinkqubo zokuhambisa eziphambili, iinkqubo zokufudumeza, iinkqubo zothutho emoyeni, ukugquma thermal kunye nezinye iinkqubo.Sisixhobo sokugcina umbane esisebenzayo nesizenzekelayo esinezi mpawu zilandelayo:

1. Ukusebenza okuphezulu: Lo mgca wemveliso unokufikelela kwimveliso eqhubekayo, uphucula kakhulu ukuveliswa kwemveliso ye-PCB.

2. I-Automation: I-solder imaski yombhalo wesikrini sokushicilela i-oven tunnel ye-oven yomisa umgca wokuvelisa ithatha iteknoloji yokulawula ngokuzenzekelayo ukunciphisa imisebenzi yezandla kunye nokuphucula umgangatho wemveliso kunye nokusebenza kakuhle.

3. Imisebenzi emininzi: Lo mgca wemveliso ungasetyenziswa kwii-PCB zeentlobo ezahlukeneyo kunye neenkcukacha zokuhlangabezana neemfuno zemveliso yeemveliso ezahlukeneyo ze-elektroniki.

4. Umgangatho ophezulu: Ngokulawula ngokungqongqo ukushisa kunye nexesha, lo mgca wemveliso unokuqinisekisa umgangatho obalaseleyo we-solder mask layer ye-PCB kunye nokuphucula ukuthembeka kwebhodi yesiphaluka.

I-Xin Jinhui inoluhlu olupheleleyo lwe-R & D kunye nezakhono zemveliso ye-PCB yebhodi yesekethe ye-solder imaski yokubhaka kwangaphambili kunye nokubhaliweyo kwesikrini sokushicilela imigca ye-oven ye-oven.Iyakwazi ukulungelelanisa imigca yokuvelisa izixhobo ze-oven ye-oven ngokweemfuno zenkqubo yeebhodi zePCB ezahlukeneyo kunye nabavelisi bebhodi yesekethe.Inenani le-software ye-Patent kunye ne-hardware ye-teknoloji, ukonga amandla ukuya kuthi ga kwi-35%, ulungelelwaniso oluphezulu lwe-hardware yombane, ukufumana ubushushu be-PLC, ukuguqulwa kwamaza okuqonda okuzenzekelayo kunye nokulawula ukumodareyitha kweqondo lokushisa, kudibaniswa nomoya oshushu ojikelezayo kunye nesantya esiphezulu. inkqubo yothutho lomoya wokufudumeza ilungelo lobunikazi ukufezekisa ukubhaka okufanayo kunye nokuqinisekisa ukuba i-pcb screen printing drying effect Ilungile kwaye iyakhawuleza, iyasebenza, igcina ixesha kunye namandla, kwaye ineesethi ze-3 zemisebenzi yokhuseleko lomlilo kunye neeseti ze-2 ze-alamu zokukhusela ukuqinisekisa ukusebenza okuzinzile 24 iiyure ngosuku.

Ngamafutshane, imaski yebhodi yesekethe ye-PCB yokubhaka kwangaphambili kunye nesicatshulwa sokushicilela i-oven ye-oven ye-oven ye-oven yokumisa umgca sisixhobo esiyimfuneko kwinkqubo yokuvelisa i-PCB.Ineempawu zokusebenza okuphezulu, ukuzenzekelayo, imisebenzi emininzi kunye nomgangatho ophezulu, onokuthi uphucule ukusebenza kakuhle kwemveliso kunye nomgangatho we-PCB kwaye uhlangabezane neemfuno zemveliso yeemveliso ze-elektroniki ezahlukeneyo.Kwixesha elizayo, kunye nokuqhubela phambili okuqhubekayo kobuchwepheshe, i-Xinjinhui iya kuqhubeka nokuphucula umgangatho wokulondoloza amandla kunye namava ahlakaniphile okuzenzekelayo kwezixhobo ze-oven yetonela, ukunceda abavelisi be-PCB banciphise iindleko kunye nokwandisa ukusebenza kakuhle, ukuphucula inkqubo esebenzayo, kunye nokwandisa ukhuphiswano lwemarike.